In a nutshell: Western Digital plans to launch mass-producing 162-layer BiCS6 3D NAND, which is at possibility of be frail in PCIe 5 SSDs by the pause of this year. The company is also working on NAND with 200+ layers meant for datacenter storage, PLC, and methods to bond collectively plenty of 3D NAND wafers to develop the series of layers.

Western Digital, along with partner Kioxia, upright gave us a watch at their roadmap for the following couple of years of NAND pattern. The company plans to introduce its Sixth generation BiCS soon, that also can feature 162 layers in TLC and QLC configurations.

While that just will not be going to sound so spectacular brooding about opponents esteem Micron indulge in had 176-layer NAND for a while now, WD claims they may be able to shrink the memory cell dimension by the exhaust of a new subject materials, resulting in smaller die sizes.

The company hopes that this will allow them to make cheaper storage devices that be aware upright as properly. Mass manufacturing of BiCS6 3D NAND is scheduled to launch in slack 2022, with WD planning to exhaust these chips in merchandise starting from low-build USB drives to PCIe 5.0 SSDs.

WD also talked about their upcoming BiCS+ memory with over 200 layers, which is position to attain by 2024. This also can feature 55 p.c extra bits per wafer, 60 p.c larger transfer tempo, and a 15 p.c larger write tempo when compared to BiCS6.

It be price noting that BiCS+ is meant to be frail most efficient in datacenter SSDs, as the corporate plans to give a varied class of 2xx-layer NAND for consumer storage, dubbed BiCS-Y.

Western Digital furthermore shared that they are working on plenty of applied sciences to present a increase to density and skill, including PLC, and that they are planning to make NAND with 500+ layers internal the following decade.


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